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WIFI Intelligent electronic refrigerator control board

C010
Customized Design:Yes
MOQ:1000pcs
Surface treatment:Immersion Gold ( Lead Free)
Board thickness:1.0mm
Copper thickness:1oz
Substrate material:FR-4
Rang of finish boards Thickness:0.21-7.0mm
Certificate:CE,Rhos,UL
Number of Layers:1-12Layers
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Product description

WIFI Intelligent electronic refrigerator control board

 

Smart Electronic Refrigerator Description:

 
1, Using variable frequency compressor, preservation, energy saving, mute in one, the biggest feature is the WIFI remote control,
2, Connect the palm preservation APP, easily break the distance between the area and space, so you can always control the refrigerator when you go out.
3, The refrigerator has a huge menu, marketing reports, can be your family's health.
4, With the convenience of Jingdong micro-WIFI interconnection intelligent management capabilities, WIFI smart can be connected through the mobile phone to achieve full monitoring, anytime, anywhere, mobile phone control refrigerator dynamics.
5, It can manage the food, a large number of recipes, provide nutrition reports, care of family health.
6, It has a large capacity of 436L, including 292L cold room, to meet the general storage of fruit and vegetable beverages.
7, The biggest feature of the refrigerator only need to install the corresponding APP, even if you go out, but also can WIFI remote control temperature of the refrigerator, manage the ingredients.
8, The business travel can be remotely controlled through the smart cloud, anytime, anywhere control of Zhang Jia refrigerator, the refrigerator at any time waiting for your dispatch.
 
PCB Layers 1 Layers to 12 layer (standard),
PCB material/type FR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger
Assembly service type  DIP/SMT or Mixed SMT & DIP
Copper thickness 0.5 OZ-5 OZ
Assembly surface finish HASL, HASL Lead Free, ENIG, OSP
PCB Dimension 600x1200mm
IC Pitch(min) 0.2mm
Chip Size(min) 201
Leg distance(min) 0.3mm
BGA Size 8x6mm~55x55mm
SMT Efficiency SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
u-BGA ball dia. 0.2mm
Required Docs for PCBA Gerber file with BOM list & Pick-N-Place File(XYRS) 
SMT speed CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs
Average hole wall copper Thickness for HAL board:25um, Gold-finger plating:0.1um
Solder mask ink photo cure ink, heat cure ink. UV ink.
Outline tolerance ±0.1mm
Hole diameter tolerance ±0.076mm
Hole location tolerance ±0.076mm
V-CUT tolerance ±0.1mm
Warp According to the IPC-600F standard
Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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