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WIFI Intelligent electronic refrigerator control board
WIFI Intelligent electronic refrigerator control board
C010
Customized Design:Yes
MOQ:1000pcs
Surface treatment:Immersion Gold ( Lead Free)
Board thickness:1.0mm
Copper thickness:1oz
Substrate material:FR-4
Rang of finish boards Thickness:0.21-7.0mm
Certificate:CE,Rhos,UL
Number of Layers:1-12Layers
Product description

WIFI Intelligent electronic refrigerator control board

 

Smart Electronic Refrigerator Description:

 
1, Using variable frequency compressor, preservation, energy saving, mute in one, the biggest feature is the WIFI remote control,
2, Connect the palm preservation APP, easily break the distance between the area and space, so you can always control the refrigerator when you go out.
3, The refrigerator has a huge menu, marketing reports, can be your family's health.
4, With the convenience of Jingdong micro-WIFI interconnection intelligent management capabilities, WIFI smart can be connected through the mobile phone to achieve full monitoring, anytime, anywhere, mobile phone control refrigerator dynamics.
5, It can manage the food, a large number of recipes, provide nutrition reports, care of family health.
6, It has a large capacity of 436L, including 292L cold room, to meet the general storage of fruit and vegetable beverages.
7, The biggest feature of the refrigerator only need to install the corresponding APP, even if you go out, but also can WIFI remote control temperature of the refrigerator, manage the ingredients.
8, The business travel can be remotely controlled through the smart cloud, anytime, anywhere control of Zhang Jia refrigerator, the refrigerator at any time waiting for your dispatch.
 
PCB Layers1 Layers to 12 layer (standard),
PCB material/typeFR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger
Assembly service type DIP/SMT or Mixed SMT & DIP
Copper thickness0.5 OZ-5 OZ
Assembly surface finishHASL, HASL Lead Free, ENIG, OSP
PCB Dimension600x1200mm
IC Pitch(min)0.2mm
Chip Size(min)201
Leg distance(min)0.3mm
BGA Size8x6mm~55x55mm
SMT EfficiencySOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
u-BGA ball dia.0.2mm
Required Docs for PCBAGerber file with BOM list & Pick-N-Place File(XYRS) 
SMT speedCHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs
Average hole wall copperThickness for HAL board:25um, Gold-finger plating:0.1um
Solder mask inkphoto cure ink, heat cure ink. UV ink.
Outline tolerance±0.1mm
Hole diameter tolerance±0.076mm
Hole location tolerance±0.076mm
V-CUT tolerance±0.1mm
WarpAccording to the IPC-600F standard


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