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Mobile Phone Remote Control Electric Heater control board
Mobile Phone Remote Control Electric Heater control board
C039
Customized Design:Yes
MOQ:1000pcs
Surface treatment:Immersion Gold ( Lead Free)
Board thickness:1.0mm
Copper thickness:1oz
Substrate material:FR-4
Rang of finish boards Thickness:0.21-7.0mm
Certificate:CE,Rhos,UL
Number of Layers:1-12Layers
Product description

Mobile Phone Remote Control Electric Heater control board

 

product features:

 
1、Composite heating: collecting radiation and convection in one, and the inside is a high-efficiency aluminum alloy heat-dissipating wing, which has strong radiation capability and large radiation area;
2 、After strict theoretical calculations of the deflectors and vents, air convection is unimpeded and the temperature rises quickly.
3、 stainless steel cover, compact structure, beautiful appearance; anti-corrosion, anti-vibration, moisture resistance;
4 、The operating cost is low, and the company's intelligent control system is used to replace the human brain with a computer to perform behavioral energy saving and achieve the ideal energy-saving effect under the premise of equal heating effect.
5、 The direct conversion of electrical energy into heat energy not only saves valuable non-renewable resources, but also fundamentally solves problems such as running, running, dripping, and leaking of the plumbing system.
6、 The surface of the cover can also electrostatically spray the user's various colors;
7、 Power range from 600W to 2000W, external dimensions can be customized according to user requirements;
8、 green, beneficial to physical and mental health.
 
PCB Layers1 Layers to 12 layer (standard),
PCB material/typeFR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger
Assembly service type DIP/SMT or Mixed SMT & DIP
Copper thickness0.5 OZ-5 OZ
Assembly surface finishHASL, HASL Lead Free, ENIG, OSP
PCB Dimension600x1200mm
IC Pitch(min)0.2mm
Chip Size(min)201
Leg distance(min)0.3mm
BGA Size8x6mm~55x55mm
SMT EfficiencySOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
u-BGA ball dia.0.2mm
Required Docs for PCBAGerber file with BOM list & Pick-N-Place File(XYRS) 
SMT speedCHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs
Average hole wall copperThickness for HAL board:25um, Gold-finger plating:0.1um
Solder mask inkphoto cure ink, heat cure ink. UV ink.
Outline tolerance±0.1mm
Hole diameter tolerance±0.076mm
Hole location tolerance±0.076mm
V-CUT tolerance±0.1mm
WarpAccording to the IPC-600F standard


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