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Gesture Control Range Hood Control Board
Gesture Control Range Hood Control Board
C038
Customized Design:Yes
MOQ:1000pcs
Surface treatment:Immersion Gold ( Lead Free)
Board thickness:1.0mm
Copper thickness:1oz
Substrate material:FR-4
Rang of finish boards Thickness:0.21-7.0mm
Certificate:CE,Rhos,UL
Number of Layers:1-12Layers
Product description

Gesture Control Range Hood Control Board

 
1.product features:
This series of products is mainly used for electronic control of range hoods. The control function of the hood can be realized with the corresponding operation parts and execution parts, the man-machine interface is friendly, the control unit is optional, and the design is made according to the customer's requirements.
Man-machine interface options:
Display mode: digital display, liquid crystal display, VFD display.
Key mode: touch switch, illuminated button, sensor button.
 
2. Technical Parameters:
2.1 voltage range: 90 ~ 230VAC.
2.2 Rated frequency: 50/60Hz
2.3 storage environment: temperature is -20 °C ~ 85 °C; humidity is less than 95% RH
2.4 use of the environment: the maximum ambient temperature of 85 °C; humidity less than 95% RH
 
3. Function introduction
3.1 timing function: can achieve regular shutdown, clock display, regular cleaning reminder.
3.2 Multi-speed control: The wind speed can be controlled by relay or thyristor.
3.3 Lighting Controls: Grading or stepless dimming.
3.4 child lock function: to prevent misuse.
3.5 Linkage function: It is possible to reserve ports according to design requirements and link other appliances.
 
PCB Layers1 Layers to 12 layer (standard),
PCB material/typeFR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger
Assembly service type DIP/SMT or Mixed SMT & DIP
Copper thickness0.5 OZ-5 OZ
Assembly surface finishHASL, HASL Lead Free, ENIG, OSP
PCB Dimension600x1200mm
IC Pitch(min)0.2mm
Chip Size(min)201
Leg distance(min)0.3mm
BGA Size8x6mm~55x55mm
SMT EfficiencySOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
u-BGA ball dia.0.2mm
Required Docs for PCBAGerber file with BOM list & Pick-N-Place File(XYRS) 
SMT speedCHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs
Average hole wall copperThickness for HAL board:25um, Gold-finger plating:0.1um
Solder mask inkphoto cure ink, heat cure ink. UV ink.
Outline tolerance±0.1mm
Hole diameter tolerance±0.076mm
Hole location tolerance±0.076mm
V-CUT tolerance±0.1mm
WarpAccording to the IPC-600F standard
 

why choose us:

 
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