| PCB Layers | 1 Layers to 12 layer (standard), |
| PCB material/type | FR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
| Assembly service type | DIP/SMT or Mixed SMT & DIP |
| Copper thickness | 0.5 OZ-5 OZ |
| Assembly surface finish | HASL, HASL Lead Free, ENIG, OSP |
| 600x1200mm | |
| IC Pitch(min) | 0.2mm |
| Chip Size(min) | 201 |
| 0.3mm | |
| BGA Size | 8x6mm~55x55mm |
| SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA | |
| u-BGA ball dia. | 0.2mm |
| Gerber file with BOM list & Pick-N-Place File(XYRS) | |
| SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
| Average hole wall copper | Thickness for HAL board:25um, Gold-finger plating:0.1um |
| Solder mask ink | photo cure ink, heat cure ink. UV ink. |
| Outline tolerance | ±0.1mm |
| ±0.076mm | |
| Hole location tolerance | ±0.076mm |
| V-CUT tolerance | ±0.1mm |
| Warp | According to the IPC-600F standard |
Tel：0755-27926380
Cell：+86-13928498993
Email：sales02@szyiergao.com.cn
Address：2 floors 4-5, Qixin Science and Technology Park, No. 18, Longtianjiedao, Pingshan District, Shenzhen, Guangdong, China
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